SoftBank is preparing to file for an initial public offering (IPO) of ARM, which could be the biggest filing of this year. Arm makes money from...
Big chip makers including TSMC and Intel are pouring money into their plans to expand advanced packaging to raise their stacks over the market. Advanced packaging...
Huawei is creating a collection of a secret chain of semiconductor-fabrication chip facilities across China to help it overcome U.S. sanctions, a Washington-based semiconductor association has...
Huawei is rumored to be testing new 5G baseband and System on Chip (SOC), this input is coming from well-known tipster – DigitalChatStation amid growing reports...
On August 15th, China’s CNIPA published a new Huawei chip patent with publication number CN116601748A, which was filed on November 28, 2020. This new Huawei patent...
On Tuesday, the board of directors of TSMC decided to invest 3.5 billion euros ($3.8 billion) to build a chip factory in Germany. This comes as...
Huawei recently published a new patent for chip stacking technology and it’s rumored that the company can stack two 14nm chips to make a 7nm chip....
Today, the Board of Directors of Taiwan’s TSMC will vote to decide on further proceedings for its chip plant in Germany. The German government will provide...
China’s patent office recently published a new Huawei chip packaging technology patent with application number CN116547791A. The title is “a chip package and a Method for...
During the fourth quarter forecast, Qualcomm talked about 5G chip supply restrictions on Huawei and it indicates that the chip seller is missing business opportunities amid...
