On May 6, Huawei published another patent for chip stack packaging with announcement number CN2114450786A, which was applied on October 30, 2019. . Last month, the Chinese tech...
On April 5, Huawei patents a new technology for chip stack packaging and equipment in China. According to the information, this patent is published with the...
Recently, Huawei’s HiSilicon Tinaguang 800 chip image was spotted, which was shared by whitsleblower@Fox Place MU Ling on Weibo. Now, Huawei has officially responded that HiSilicon...
Huawei aims to build a wafer fab manufacturing with the help of SMIC in Shenzhen, China reported by Chinese Media. The SMIC is the largest wafer...
On December 28, Huawei has established a new precision manufacturing company with a registered capital of 600 million yuan, which is quite a big investment. After...
According to the latset news, OpenHarmony 3.0 was transplanted to the Zilong development board with MIPS ARCH and 1c300B chip transplantation within a week. However, at...
Huawei semiconductor subsidiary – HiSilicon has officially debuted the high definition TV chip Hi373V110 that uses Huawei’s fully owned RISC V architecture CPU. This new TV...
On December 3, a new Huawei patent entitled “a device for detection chip cracks” was published with announcement number CN1137484895A in China. As per the China...
Recently, Huawei’s CBG CEO – Yu Chengdong stated that Huawei will not give up its smartphone business and stated that “King will return in 2023” in...
HiSilicon is the chip designer subsidiary of Huawei and is best known for its Kirin processors performance. The chips designing company has a number of different...
