A new report says that Huawei is paying attention to Chinese companies in order to improve chip packaging technologies. The company’s semiconductor unit HiSilicon sends an...
On May 6, Huawei published another patent for chip stack packaging with announcement number CN2114450786A, which was applied on October 30, 2019. . Last month, the Chinese tech...
On April 5, Huawei patents a new technology for chip stack packaging and equipment in China. According to the information, this patent is published with the...
