Huawei will continue to invest in HiSilicon to build its chips manufacturing capability, says Huawei Chairman

Huawei Rotating Chairman, Guo Ping recently released a message for Huawei Staff and said the company will continue to invest in HiSilicon and work with front-end partners to improve and build their own capacity to manufacturer their own semiconductors in the upcoming years.

“I believe that in a few years we’ll have a stronger HiSilicon” Guo said.

The current suppression of Kirin chips will cause certain difficulties for our terminals, especially high-end mobile phones, but I believe we can solve them.

Last month, the U.S. government increased its pressure on the Chipmakers to drop business with Huawei and restrained them to not manufacture or sell new chips for the company.

Following this new restriction, Huawei Chief of Consumer Business, Richard Yu announced that there’ll be no new high-end Kirin chipset manufacture after September 15, 2020.

However, Huawei has one last high-end Kirin chipset that may unveil at IFA 2020, more information yet comes but we’ll keep you posted.

Guo also mentioned the halt in Google Mobile Services (GMS) for Huawei smartphone and the difficulty in overseas markets but he also seems happy with the results obtained by Huawei Mobile Services (HMS) since its launch in 2019.

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