Huawei patents new technology to reduce cost of chip packaging

On April 5, Huawei patents a new technology for chip stack packaging and equipment in China. According to the information, this patent is published with the number CN114287057SA and belongs to the field of semiconductor technology.

Due to the US restrictions, Huawei is facing a lot of difficulties and a shortage of core components, especially smartphone chips. Therefore, the company is continuously making efforts and developing new chip-related technology.

According to the information, Huawei patents chip stack packaging technology to reduce the cost, which is caused by the usage of Silicon while ensuring the demand for power supply.

The chipset is the core component of any electronic device. So, the reduction in the cost of the chip stack package can lower the overall cost of the device as well. To know more, you can check the full description below of the chip stack package and what it includes.

Description:

• A first chip (101) and a second chip (102) were disposed of between the first wiring structure (10) and the second wiring structure (20).
• The active surface (S1) of the first chip (101) faces the active surface (S2) of the second chip (102).
• The active surface (S1) of the first chip (101) includes a first overlapping area (A1) and a first non-overlapping area (C1), and the active surface (S2) of the second chip (102) includes a second overlapping area (C1) an overlapping area (A2) and a second non-overlapping area (C2).
• The first overlapping area (A1) overlaps the second overlapping area (A2), and the first overlapping area (A1) and the second overlapping area (A2) is connected.
• The first non-overlapping region (C1) is connected with the second wiring structure (20).
• The second non-overlapping region (C2) is connected with the first wiring structure (10).

(Via: ithome)