Huawei P70 series prepares for mass production with new components order

It seems that Huawei approaching fast toward the mass production stage for its next flagship – the Huawei P70 series. The Chinese tech maker has contacted suppliers to reserve the required components.

Supply chain sources revealed that Huawei has been reserving parts and electronic components to prepare for the mass production of the Huawei P70 series. This phone will launch in 2024.

Last month, Huawei unveiled the Mate 60 series in China and the company keeps on doing robust sales. The figures keep on improving and the company is running low in the stocks for sellers.

The popularity of the Huawei Mate 60 series gave Huawei a new confidence. And Huawei P70 could become a defining moment for the company.

Industry Analyst, Ming-Chi Kuo previously said that Huawei will order at least 30-40 million components for next year’s P-series and Mate-series models. He also shared information that Compeq will be the supplier of the mainboard of the next P and Mate series devices. This firm manufactures products such as regular multi-layered PCBs, high-density interconnection (HDI), high layer count (HLC), flexible PCBs (FPC), and rigid-flex PCBs.

Another set of sources mentioned that Huawei could sell between 60-70 million smartphones in 2024. This shipment estimate is larger than the past three years. The projected shipment is based on the current demand for Huawei phones in the market.

To prepare for any hostile action from the US, the Chinese tech company also seeking components including camera lenses, cameras, PCBs, and other important electronic components.

For now, it’s unclear whether this mega P-series flagship will use Kirin 9000s or an advanced chipset with powerful performance. However, it’s very likely that the company could refrain from Snapdragon for a long time.

Although, we’re still away from mass production but Huawei’s early approach toward suppliers is a sign that the Huawei P70 would be an interesting flagship.

(source)