Huawei may discuss 14nm and 12nm chip this month

A tipster suggest that Huawei could hold a meeting to discuss the use case of 14nm and 12nm chips. However, this meeting will remain with certain industry partners and shareholders.

Information from FixedFocus suggests that there’s a rumor in the industry that it could be 720 SoC. This Huawei chip is using SADP process and 14nm+++, 12nm node. It is more like the two of these nodes might be a part of the discussion.

More on this, the tipster mentioned that Huawei will hold a new tech seminar on May 24, 2023. This will be an internal meeting to showcase the technology to industry partners. However, there’s no official confirmation of this information.

SADP:

Self-aligned double patterning (SADP) is a form of double patterning. It is sometimes referred to as pitch division, spacer, or sidewall-assisted double patterning. The SADP process uses one lithography step and additional deposition and etch steps to define a spacer-like feature.

Hi-end node?

The naming convention is sort of familiar to our past experiences. For example, the name fits perfectly as “Kirin 720”. Meanwhile, some people in the comment suggest that SADP was used for low-end nodes such as 28nm to 14nm. Therefore, it can’t be expanded to 12nm.

It is expected that 7nm needs the SADP process and N3 will use SAQP later. To be mentioned, advanced (small) chipset manufacturing requires high-tech technology, which is not the case with large chips.

For now, we have some unconditional truth of waiting more on high-end nodes for chipsets from Huawei’s corner.

Aside from these, Huawei could surprise us with various chipset solutions including Ascend, Shenteng, Kunpeng, and others. Furthermore, Kirin may also debut as Kirin A2 in a small form factor for wearable devices. But we’ll have to carry forward some hope for the smartphone version of Kirin.

Whatever happens, we’ll keep you posted on all of the action in the Huawei semiconductor division.

(Source)