Huawei
Huawei Mate 70 RS Ultimate has the most solid back cover: Tipster
Huawei Mate 70 RS Ultimate Design has the most solid back cover in the market. That says a tipster while dismantling the new flagship handset to dive into its core. The statement implies that the device is quite tough to break or suffer any damage.
Several tipsters are busy disassembling the Mate 70 devices. Yesterday, we reported how a tipster revealed the Kirin 9020 chipset layout in the Mate 70 RS Ultimate.
Now the same tipster says that Huawei Mate 70 RS has the most solid back cover in the market. He mentioned that the new flagship is too difficult to tear down even for masters. One has to put a lot of effort into creating a crack and opening this device.
He frankly said that the Huawei Mate 70 RS Ultimate Design has the most “difficult” back cover he had ever encountered. He even showed the device clamping in the hand from a slight crack. The device didn’t fall but remained stuck to his fingers.
“At this point, the back shell is still very solid, and other areas are tightly connected. It can even clamp in the hand firmly without falling. I just decided to scrap it and inserted my fingers into the gap to pry it open before I could remove the back cover.” – said tipster Yang Changshun.
After removing the back cover, the glue started dripping from the sides but it remained strongly viscous, ensuring durability and sticking properties.
Yang noted that Huawei has used richer and tougher materials to craft the new Mate 70 models. It has wrapped the device with a high-gloss titanium body architecture which not only makes the device beautiful but also tough towards external damage.
Looking inside the device, the Mate 70 RS cover has shock-proof elements covered with silicon. This specially designed silicon reduces the risk of falling damage to the device. The tipster says that such a design has never been seen on other models.
The middle frame in the Mate 70 series has significantly grabbed the focus in terms of durability. It doesn’t have any gaps and hence, protects the internal components of the smartphone. It also boosts heat dissipation and indirectly supports communication capabilities.