Huawei has a new idea for chipset packaging

On May 6, Huawei published another patent for chip stack packaging with announcement number CN2114450786A, which was applied on October 30, 2019. . Last month, the Chinese tech marker discloses a technology to reduce the cost of chip packaging.

The latest patent technology for chip packaging aims to solve the problem of how to reliably bond multiple secondary chip stacking units to a single main chip stacking unit. As we are familiar with Huawei’s chip shortage issue going on for a long time.

The chipset is the most important and core component that will be equipped in any device. Therefore, Huawei is innovating new ideas and securing them in the form of patents for future use. So, let’s explore Huawei’s new idea for chip packaging in detail.

Read more: Huawei has new chip packaging component manufacturing process

New structure for chip packaging:

• A main chip stacking unit has a plurality of main pins on the first surface that are insulated and arranged at intervals.

• The first bonding layer is arranged on the first surface. The first bonding layer includes a plurality of bonding components that are insulated and arranged at intervals.

• Each of the plurality of bonding assemblies includes at least one bonding portion, any two bonding portions are insulated and disposed of, and any two bonding portions have the same cross-sectional area. The plurality of bonding assemblies is respectively connected to the plurality of main pin keys combine.

• A plurality of secondary chip stacking units is arranged on the surface of the first bonding layer on the side away from the main chip stacking unit.

• The sub-chip stacking unit has a plurality of micro-bumps that are insulated and spaced apart. Each of the plurality of micro-bumps is bonded to one of the plurality of bonding components.

(Via)