Huawei and other Chinese firms reportedly aim to make advanced AI chips by 2026

Huawei is constantly planning new strategies for its advanced AI chips and it seems the results might appear by 2026. That says a new report, hinting that a group of Chinese chip firms led by Huawei are speedily working on an ‘AI processors’ project.

TheInformation reported that some other Chinese semiconductor firms including those, which come under Huawei are planning to develop advanced HBM AI chips by 2026. These are quite essential components in the making of high-end processors.

What is HBM?

HBM refers to high-bandwidth memory chipsets. It is a new type of memory chip that has low power consumption than others and delivers ultra-wide communication lanes.

It enables multiple layers of memory chips stacked on top of each other reducing the footprint and used in conjunction with high-performance graphics accelerators, and network devices, as well as a key component for AI chipsets.

Even though HBM chips don’t get counted under U.S. trade rules, these are developed via American chip technology that Huawei and other firms can’t access.

Huawei aims to develop advanced AI chipsets by 2026 (Image Credits: Huawei)

New AI chip development project is China’s attempt to support its native companies and introduce a better alternative to Nvidia’s AI processors. Chinese companies are also joining hands with new chip makers like Fujian Jinhua Integrated Circuit, which has been on the U.S. ban list alongside Huawei.

Huawei-led Chinese chip companies group is also seeking producers and developers that can effectively work with Huawei and help it to build self-designed AI chips, by delivering better as well as tech-pack components.

China is making every possible effort to support its companies and end up the reliance on U.S. chips and their technologies. The new effort, if succeeds, will ultimately help the native region to get over Nvidia’s ‘not so efficient’ AI processors.

(Source – Reuters)