Honor Magic V2 specs leak hints battle against Huawei Mate X3

Honor is preparing to launch a new folding phone. Now, a new specs leak on Honor Magic V2 shows new technologies to battle against Huawei Mate X3 in low weight and size segment.

According to the information coming from Weibo, Honor Magic V2 to bring a new ultra-slim type C port module. This technology was first introduced with Huawei Mate X3. And now Honor is pursuing it for the upcoming foldable.

This allows the phone to reduce the height of the frame and keep it stable with the top and bottom margins. The new design is quite thin compared to the Huawei Mate X2.

Honor Magic V2 to bring light, thin foldable design

Depth:

The tipster reveals that the depth of this upcoming foldable phone from Honor will be around 6mm. Note that this measurement is for the entire screen in the unfolded state. Meanwhile, the first-generation Honor Magic V and Magic Vs count at 6.7mm and 6.1mm depths respectively.

On the other side, the Huawei Mate X3’s depth is 5.3mm, which surpasses all of the foldable smartphones in the market.

Weight:

To achieve a light design, Honor could bring the weight down to around 240 grams. This is a major change that the phone maker is planning for the Magic V2 because the past two devices stand at over 280 grams.

Furthermore, the device also supports 50W super-fast wireless charging, which is another interesting feature to add.

Chipset:

Tipster classmateguan revealed that the upcoming Honor phone has two versions – standard and Pro models. The first version is tested with Qualcomm Snapdragon Gen 1 and the latter version uses Snapdragon Gen 2 chipsets. These chips will help the phone to provide better performance.

Honor Magic V2 launch date:

Aside from the specs leak, Honor has not announced an exact date or identity confirmation for Magic V2. However, past report suggests that it would make its debut around the third quarter of this year. But the earliest possibility could be in July.

(source)