Honor Magic 6 RSR tipped to bring Titanium frame and Snapdragon 8 Gen 3 chipset

Honor Magic 6 RSR Porsche Design smartphone is likely to show up at the launch stage in March and a leak hints that the device may equip the Snapdragon 8 Gen 3 chipset along with robust titanium frame. The ultimate model could follow its siblings for specs.

The Magic 6 RSR recently appeared on the MIIT database, confirming the satellite connectivity support. As of now, a new input reveals some more significant parameters of the respective smartphone ahead of the official unveiling.

Weibo tipster @JinanDigital states that Honor Magic 6 RSR Porsche Design could use the Snapdragon 8 Gen 3 chipset. It is an octa-core chip based on 4nm process technology. Meanwhile, the CPU configuration of this processor is as follows:

• 1 core Cortex-X4 at 3.3GHz
• 5 core Cortex-720 performance cores clocked at 3.0-3.2GHz
• 2 Cortex-520 efficiency cores at 2.3GHz

Besides, the leak adds that the device may adopt a Titanium metal frame which could exhibit high-strength and lightweight traits. Ahead, the device is likely to use giant Rhino Glass that ensures the display protection from all corners and factors like high-fall or extreme scratches.

The device is further hearsay to bear a similar 3D Face Recognition facility to the Magic 6 Pro model. In terms of optical segment, the Porsche Design model may possess variable aperture technology with a 1-inch large main camera sensor.

Even though Honor Magic 6 RSR has been in rumors for a long time, the Chinese tech giant has not confirmed any of these specs so far. Probably, we may find official details on this matter by late February or early March this year.

Honor Magic 6 Series: Global Launch

Apart from new product development, Honor is also focusing on the global launch of the Magic 6 series. Alongside, the company will unveil the Magic V2 foldable on the consumer stage. It would be worth seeing if Honor showcases the V2 RSR Porsche Design at the same event.

(Source)