HiSilicon V811: 8K 30Hz decoding, 4K 120Hz MEMC and more

Huawei has now upgraded its video decoding encoding chipset to HiSilicon V811 for projection devices. Notably, it supports video decoding with a resolution of up to 8K30Hz, which is a brand-new capability.

Without further ado, let’s take a look at the specifications.

The new Huawei HiSilicon chip V811 is equipped with A73+A53 quad-core architecture, and the GPU is quad-core G51, which has powerful 8-core computing capabilities and supports up to 8K 30Hz.

Mainstream video formats include AVS2, MPGE2, H.264, H.265, VP9, ​​RMVB, and more. It has built-in 4K 120Hz MEMC, far-field voice solutions, support HDMI 2.0/USB 3.0, and other interfaces, and the maximum memory is 6GB.

Huawei HiSilicon chip V811 integrates Histen sound quality optimization technology. It also has Dolby TrueHD and DTS-HD and other mainstream audio decoding and sound processing. It delivers five aspects of sound field expansion, transient distortion correction, dialogue enhancement, loudness adaptive, and intelligent bass aspects bringing a more layered sound performance.

The new version of Huawei HiSilicon V811 is more powerful than its predecessor. The overall decoding ability and performance have been further improved. That’s how the image quality engine and sound quality have received a new boost.

Related – Huawei HiSilicon V811 chip launched with new 4K projector

Specifically, the new Hisilicon V811 has exclusive image quality optimization effects. These include:

• MEMC (dynamic image compensation)
• HDR (high dynamic range imaging)
• SR (super-resolution algorithm)
• NR (noise reduction algorithm)
• DCI (Dynamic Contrast Enhancement)
• ACM (Intelligent Accurate Color Matching)
• LD (District Light Control)

Other seven advanced picture quality technologies can comprehensively improve the picture quality of the equipped device.

The chip can achieve smooth motion pictures without smearing, yet clearer and more delicate display output. These are supported with rich colors, improved layering, and detail expressiveness.

Important:

To reiterate, the chipset is already launched previously by HiSilicon and this new version comes with several improvements over its predecessor.