Chip makers to boost 5G RF component production, could help Huawei to bring back 5G phones

The 5G RF (radio frequency) components are a big concern for Huawei as it’s forced to launch its flagship with 4G network access. Launched on July 29 this year, the Huawei P50 series packs a sumptuous camera system, software capabilities, and design. However, the smartphone lacks a 5G communication network.

As reported previously, core 5G components use radiofrequency waves divided into Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW). Among them, the smartphone makers prefer BAW, whose market is mainly ruled by US chipmakers that are restricted to sell 5G chips to Huawei due to US-Sanctions.

Furthermore, a recent report shows that like other markets, the chip industry has its own working flow. It includes manufactories, packaging, and testing plants to supply 5G RF components. Now the chip foundries are working to expand their business relations and planed of producing more 5G smartphone chips. The positive side of this news is that Huawei could also get access to 5G RF components to bring its 5G smartphones.

Chip Market Status in China:

According to the report, Vanchip Technologies which is a sub-foundry of MediaTek is seeking to work with GaAs. The two parties are accelerating their production to meet the 5G demands across the mainland.

Moving ahead, Qualcomm also contacted Wenmao that will responsible for G sub-6GHz power amplifier (PA). Adding to this, another Chinese supplier Hongjie Technology will provide Qualcomm the advanced 6-inch wafers.

In this line, Qualcomm also extending the RF collaboration on 5G RF front-end products with GlobalFoundries (GF). The collaboration includes sub-6 GHz and cutting-edge mmWave technology to unlock everyday 5G access.

Global Chip Market Status:

The United States and Japan are monopolizing the global chip market at present. The fabless manufacturers including Qualcomm, Qorvo, and Skyworks are planning to work together.

Besides, the other manufactures such as ASE, Amkor, and Changjiang Electronics Technology have ramp-up system-in-package (SiP) and antenna packaging (AiP) integration in their products.