A new Huawei chip packaging patent reveals performance verification technology

China’s patent office recently published a new Huawei chip packaging technology patent with application number CN116547791A. The title is “a chip package and a Method for preparing chip package”. It was applied on December 16, 2020, and approved on August 4th, 2023.

According to the summary, the patent has a chip packaging process to improve its performance along with verification. The chip package consists of a substrate, a bare chip, a first protection structure, and a barrier structure.

The technical description demonstrates a chip, the first protection structure, and the barrier structure are all disposed of on the first surface of the substrate.

The first protection structure is wrapping the side of the bare chip, the barrier structure wraps the surface of the first protection structure away from the bare chip, and the first surface of the bare chip, the first surface of the first protection structure, and the first surface of the barrier structure are flush.

The first surface of the bare chip is the surface of the bare chip facing away from the substrate. The first surface of the first protection structure is the surface of the first protection structure facing away from the substrate, and the first surface of the barrier structure is the surface of the barrier structure. The structure faces away from the surface of the substrate.

Huawei Chip:

Currently, the latest Huawei Chip Packaging patent remains on the website. While there’s no confirmation of its implications in the production. However, Huawei is continuously developing chip manufacturing technologies.

Earlier this year, Huawei announced its own EDA chip designing tools and there are reports that the company is working closely with other Chinese semiconductor makers.

Huawei has a long-term experience in chip designing with its subsidiary – HiSilicon and the company continue to research on a new design. However, we’re still awaiting for a complete finished chip product from these new technologies.

(via)