Huawei Kirin 7nm chip performance draws level with TSMC 5nm: Report

A new teardown report implies that the latest Huawei Kirin 7nm chip is on par with the TSMC 5nm processor in performance. Despite the U.S. efforts to pull back China in the chipset race, the region is doing good and may soon achieve new success.

TechanaLye – a Japanese semiconductor research company performed a teardown between two Huawei phone chips. One belongs to the Pura 70 series: Kirin 9010. Whereas, the other one comes out of a top-end Huawei model from 2021.

As per the details, the circuit diagrams of both processors differ from each other. The latest Kirin chip designed by HiSilicon belongs to SMIC and has adopted a 7nm process while the 2021 device’s SoC comes from TSMC and runs on 5nm tech.

Comparing the performance aspects, TechanaLye found the Huawei Kirin 7nm chip draws level with TSMC 5nm. The chips differ in size (SMIC 7nm = 118.4 sq. mm.; TSMC 5nm = 107.8 sq. mm.). Yet ‘they have similar areas and performance levels’.

The CEO of TechanaLye – Hiroharu Shimizu notes that HiSilicon improved its design capabilities over time. Huawei’s subsidiary now makes better and stronger processors that are comparable to TSMC 5nm chip regardless of wider circuit width.

In 2021, TSMC used to ship 5nm-based chipsets to Huawei smartphones. But at that time, the U.S. blacklisted the Chinese OEM, dragging it out of its export trade. The government even prohibited foreign suppliers to ship advanced products to China.

TSMC’s Kirin 9000 chip on left, and SMIC’s Kirin 9010 chip on right. (Image Credits: TechanaLye)

Following these challenges, Huawei joined forces with SMIC to develop its Kirin chips based on the 7nm process. The company revived its Kirin chip with Mate 60 Pro last year and introduced a new and more optimized SoC in the form of Kirin 9010 with Pura 70 Ultra. Now we may grab another iconic processor with the Mate 70.

Hiroharu further reveals that the Pura 70 Pro runs on 37 processors paired with memory, sensors, cameras, power supply, and visual functions. 14 of these semiconductors belong to HiSilicon while 18 are from other Chinese suppliers. 5 come from foreign developers such as SK Hynix (DRAM) and Bosch (motion sensors).

TechanaLye’s CEO said:

“In effect, the only semiconductors subject to the U.S. regulations are cutting-edge server chips for AI and other applications. As long as the chips do not pose a military threat, the U.S. is probably allowing their development.”

He adds that the U.S. trade export controls have only made China more self-dependent in producing semiconductors. China chips’ capabilities lag just three years from TSMC and it may catch up soon in the advanced chipset battle.

China is already seeking ways to expand its chip mass production and improve its existing technology. However, the latest report hints that Chinese firms will soon create hurdles for TSMC. The Taiwan chipmaker is already dealing with minimizing the circuits, which is a difficult task. It would be interesting to see how this matter moves ahead.

|| Source – Nikkei Asia ||